Govt. Exams
Entrance Exams
Silicon has dominated modern rectifiers because of significantly lower reverse saturation current (leakage ~nA at room temperature vs ~µA for Ge), better temperature stability, and superior thermal properties. The extra 0.4V drop is offset by reduced losses in high-power applications.
The Early effect occurs because increased reverse bias widens the depletion region, reducing the effective base width. This decreases recombination in the base and increases collector current. The Early voltage V_A is inversely proportional to base doping concentration.
In photoconductive (reverse-bias) mode, the depletion region widens significantly, reducing junction capacitance and transit time, resulting in faster response (MHz to GHz range) and shot noise is suppressed due to the reverse field.
The depletion width W = √(2εε₀(V_bi + V_R)/(eN_D N_A/(N_D + N_A))) depends on applied voltage, doping concentrations, and built-in potential. Both doping levels and reverse bias voltage are critical factors.
Due to lower hole mobility in PMOS (~2-3 times lower than electron mobility in NMOS), the PMOS width must be 2-3 times larger to match switching speeds and minimize inverter delay.
FinFETs employ multiple gates (typically 3 gates) wrapping around a thin silicon fin, providing superior electrostatic control of the channel, reducing short-channel effects and subthreshold swing.
The process transconductance parameter k_n = μ_n × C_ox determines how efficiently the MOSFET converts gate voltage to drain current. Both μ_n and C_ox are independent device parameters.
At low forward bias, electrons tunnel through the narrow bandgap, creating peak current. As voltage increases, direct band-to-band current dominates, causing current to decrease with voltage (negative differential resistance).
Higher doping concentrations create stronger electric fields at lower voltages, reducing Zener breakdown voltage. This allows designing Zeners with specific breakdown voltages (3.3V, 5.1V, etc.).
Maximum power point (MPP) occurs where P = V × I is maximum, typically at ~80% of V_oc and ~80% of I_sc, determined by the fill factor.