Govt. Exams
Entrance Exams
The approach temperature is defined as: Approach = T_gas,out - T_steam,out. Given that typical exhaust exit from HRSG is around 450°C and approach is 5°C, T_steam,out = 450 - 5 = 445°C.
The Colburn factor (j) is a dimensionless group that relates heat transfer characteristics to flow properties. It connects the Stanton number to the Prandtl number: St = j/Pr^(2/3), allowing transfer of empirical heat transfer data to different systems.
For energy balance: Ch(Th,in - Th,out) = Cc(Tc,out - Tc,in). So Ch(100-60) = Cc(50-30), which gives Ch/Cc = 20/40 = 0.5. This is the capacity rate ratio.
x_th = 0.05 × Re × Pr × D = 0.05 × 1000 × 7 × 0.025 = 8.75 m. This is the distance from the entrance where thermal development is completed (approximately 99% developed).
Using Q = UAΔT and considering fouling resistance: ΔT_fouling = Q × Rf / A = 5×10⁶ × 0.0005 / 100 = 25 K. However, for the temperature loss specifically attributed to fouling layer: ΔT = Rf × (Q/A) = 0.0005 × (5×10⁶/100) = 2.5 K.
The Grashof number Gr = (ρ²gβΔT L³)/(μ²) represents the ratio of buoyancy forces to viscous forces in natural convection. It determines the onset of natural convection and its intensity.
In cross-flow (especially unmixed-unmixed), the temperature gradients are not as favorable as counter-flow because one or both fluids cannot maintain continuous temperature gradient alignment, resulting in lower effectiveness and hence lower LMTD correction factor.
Thermographic imaging using infrared cameras is a non-intrusive, real-time method that can measure surface temperature variations across the heat transfer surface without disturbing the flow, making it practical for industrial monitoring.
Dropwise condensation provides heat transfer coefficients 5-10 times higher than filmwise condensation because liquid droplets continuously shed, exposing fresh surface to direct contact with steam. However, filmwise condensation is more common industrially due to stability issues with dropwise condensation.
Heat pipes achieve very high effective thermal conductivity (often >1000 times that of copper) through the latent heat of evaporation and condensation of working fluid, making them ideal for high-power electronics cooling despite the small cross-sectional area.